HKMA demonstrates potential of tokenisation to corporate treasury community (with photos)
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The Hong Kong Monetary Authority (HKMA) organised a seminar on Corporate Treasury x Tokenisation: The Hong Kong Advantage in Action earlier this week. This event was the first one organised by HKMA in recent years specifically targeting at corporate treasurers and relevant stakeholders. Over 150 participants attended the event, including representatives from about 50 corporates, 30 financial institutions, and various treasury associations.
Tokenisation holds the potential to enhance efficiency and reduce transaction cost, and is gradually gaining attention among corporate treasurers. As such, the HKMA organised this seminar to demonstrate recent use cases of the technology in corporate treasury operations with a view to enriching practitioners' knowledge in the field and encouraging the industry to join HKMA's initiatives, such as Project Ensemble which aims at fostering the development of Hong Kong's tokenisation ecosystem, as well as to consider issuing tokenised bonds through leveraging HKMA's support measures.
During the event, participants exchanged views in two lively panel conversations covering the Project Ensemble use cases for real-time treasury management, and leveraging tokenisation in bond issuance and trade finance. Panellists generally shared the view that the potential associated with tokenisation is immense, and welcomed the ongoing efforts to promote greater market adoption of the technology, thereby bringing a larger and more active ecosystem.
Following this event, the HKMA will follow up with corporate treasury centres (CTCs) which have indicated interest in the field of tokenisation with a view to exploring plans for future collaboration. In line with the Government's Action Plan to Promote the Development of CTCs in Hong Kong announced yesterday (June 9), the HKMA will also engage CTCs on other topics of interest so as to promote their use of Hong Kong's financial platform and obtain market feedback.
Ends/Wednesday, June 10, 2026
Issued at HKT 18:00
Issued at HKT 18:00
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