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Result of the tenders of RMB Sovereign Bonds held on April 22, 2026
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The following is issued on behalf of the Hong Kong Monetary Authority:

     ​Result of the tenders of RMB Sovereign Bonds held on April 22, 2026:
 
Tender Result
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Tender Date : April 22, 2026
Bonds available for Tender : 2-year RMB Bonds
Issuer : The Ministry of Finance of the People's Republic of China
Issue Number : BCMKFB26002 (Further Issuance)
Issue and Settlement Date : April 24, 2026
Maturity Date : February 13, 2028 (or the closest coupon payment date)
Coupon Rate : 1.38%
Application Amount : RMB 19,950 million
Issue Amount : RMB 5,000 million
Average Accepted Price : 100.17
Lowest Accepted Price : 100.11
Highest Accepted Price : 100.32
Allocation Ratio (At Lowest Accepted Price) : Approximately 63.08%
 
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Tender Date : April 22, 2026
Bonds available for Tender : 3-year RMB Bonds
Issuer : The Ministry of Finance of the People's Republic of China
Issue Number : BCMKFB26003 (Further Issuance)
Issue and Settlement Date : April 24, 2026
Maturity Date : February 13, 2029 (or the closest coupon payment date)
Coupon Rate : 1.40%
Application Amount : RMB 20,390 million
Issue Amount : RMB 5,000 million
Average Accepted Price : 100.21
Lowest Accepted Price : 100.11
Highest Accepted Price : 100.41
Allocation Ratio (At Lowest Accepted Price) : Approximately 22.75%
 
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Tender Date : April 22, 2026
Bonds available for Tender : 5-year RMB Bonds
Issuer : The Ministry of Finance of the People's Republic of China
Issue Number : BCMKFB26004 (Further Issuance)
Issue and Settlement Date : April 24, 2026
Maturity Date : February 13, 2031 (or the closest coupon payment date)
Coupon Rate : 1.57%
Application Amount : RMB 22,069 million
Issue Amount : RMB 4,500 million
Average Accepted Price : 100.42
Lowest Accepted Price : 100.32
Highest Accepted Price : 100.78
Allocation Ratio (At Lowest Accepted Price) : Approximately 55.07%
 
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Tender Date : April 22, 2026
Bonds available for Tender : 15-year RMB Bonds
Issuer : The Ministry of Finance of the People's Republic of China
Issue Number : BCMKFB26010
Issue and Settlement Date : April 24, 2026
Maturity Date : April 24, 2041 (or the closest coupon payment date)
Application Amount : RMB 8,829 million
Issue Amount : RMB 1,000 million
Average accepted Coupon Rate : 2.05%
Highest accepted Coupon Rate
(Bonds' Coupon)
: 2.08%
Lowest accepted Coupon Rate : 1.90%
Allocation Ratio (At Highest accepted Coupon Rate) : Approximately 1.14%

 
Ends/Wednesday, April 22, 2026
Issued at HKT 16:05
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