Application period of 2026 Innovation and Technology Support Programme (Platform & Seed) announced
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The ITSP (Platform & Seed) aims to support applied research and development (R&D) projects undertaken by R&D centres or designated local public research institutes with a view to transferring R&D results to local industries. Platform projects are applied R&D projects that are industry-oriented and have potential for commercialisation, while seed projects are exploratory and forward-looking projects.
An ITC spokesman said, "To fully align with the country's 15th Five-Year Plan, the ITC welcomes applications closely related to the technology areas highlighted in the Plan (quantum technology, embodied AI, etc). Applications related to other technology areas that meet the eligibility requirements are also welcome. To allow applicants more time to prepare their proposals and identify industry partners, we have brought forward the announcement of this year's application period."
Further information on the ITSP (Platform & Seed) is available on the Innovation and Technology Fund (ITF) website (www.itf.gov.hk/en/funding-programmes/supporting-research/itsp/itsp-platform-seed/index.html). For enquiries, please contact the ITF Secretariat (Tel: 3543 5904; email: enquiry@itf.gov.hk).
Ends/Wednesday, April 1, 2026
Issued at HKT 10:00
Issued at HKT 10:00
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