EDB to launch new round of E-APP applications tomorrow
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The E-APP is a free electronic application platform. Applicants may complete one application via the E-APP to apply for most post-secondary programmes that are not covered under the JUPAS. Relevant institutions will process applications from the E-APP as early as possible and may give eligible candidates conditional offers before the announcement of HKDSE Examination results.
The main round of E-APP applications will run from tomorrow until May 14, 2019, and the second round of applications will last from May 21 to June 30, 2019. In general, institutions will first process applications received in the main round.
"Before applying via the E-APP, students may browse the Concourse for Self-financing Post-secondary Education website (www.cspe.edu.hk), which provides information on post-secondary institutions and details of about 450 full-time locally accredited higher diploma, associate degree and undergraduate programmes that are not covered under the JUPAS for the 2019/20 academic year, including their tuition fees, entry requirements, and accreditation and recognition by relevant professional bodies. Institutions' estimated number of intake places, their application and admission arrangements for the 2019/20 academic year as well as their past admission scores and graduate statistics will also be uploaded onto the Concourse website,” a spokesman for the EDB said.
The Concourse will also provide information on full-time University Grants Committee-funded undergraduate programmes offering senior year places, and self-financing top-up degree programmes in the 2019/20 academic year, so as to help graduates and students of sub-degree programmes plan for their further studies.
Ends/Wednesday, December 5, 2018
Issued at HKT 12:00
Issued at HKT 12:00
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