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2012 Innovation and Technology Fund open for applications

     The Innovation and Technology Commission is now inviting funding applications under the Innovation and Technology Support Programme (ITSP) of the Innovation and Technology Fund (ITF).
     The ITSP adopts a three-tier framework in funding applied research projects. This application exercise covers Tier 2 and Tier 3 funding. Tier 2 involves the funding of projects that are industry-oriented and have potential for commercialisation, while Tier 3 involves the funding of exploratory and forward-looking projects. Application forms and the Application Guide are available at .

     The application period commenced today (January 30) and will last until March 30 (Friday).

     Further information on the ITSP funding schemes and application procedures can be obtained from the ITF Secretariat at 21/F, West Wing, Central Government Offices, 2 Tim Mei Avenue, Tamar, Hong Kong (Tel: 3655 5725; fax: 2957 8726; email:

Ends/Monday, January 30, 2012
Issued at HKT 15:34


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