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The Innovation and Technology Commission is now inviting the second round of funding applications for 2014 under the Innovation and Technology Support Programme (ITSP) of the Innovation and Technology Fund (ITF).
The ITSP adopts a three-tier funding framework. This application exercise covers Tier 2 and Tier 3 funding. Tier 2 involves the funding of applied R&D projects that are industry-oriented and have potential for commercialisation, while Tier 3 involves the funding of exploratory and forward-looking R&D projects. Application forms and the application guide are available on the ITF website: www.itf.gov.hk.
The application period commenced today (July 30) and will last until September 30 this year.
Further information on the ITSP funding schemes and application procedures are available on the ITF website and can also be obtained from the ITF Secretariat at 21/F, West Wing, Central Government Offices, 2 Tim Mei Avenue, Tamar, Hong Kong (Tel: 3655 5725; fax: 2957 8726; email: enquiry@itf.gov.hk).
Ends/Wednesday, July 30, 2014
Issued at HKT 15:42
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