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Proposals for applied research and development (R&D) projects are being invited under Tier 2 and Tier 3 of the Innovation and Technology Support Programme (ITSP) of the Innovation and Technology Fund (ITF). The application exercise commences today (December 9) and will last until February 5, 2010.
"Similar to the project solicitation exercise in January this year, there are 12 technology themes under this round of Tier 2 solicitation, covering advanced manufacturing technologies, integrated circuits, organic electronics, new technologies for high-efficiency photovoltaics, information technologies, multimedia technologies, Chinese medicine, novel medicines and medical devices, biotechnology, anti-pollution technologies and energy-saving technologies. These themes are relevant to the needs of industry and will enhance our economic development," a spokesman for the Innovation and Technology Commission said.
"Project solicitation for Tier 3 funding, which supports R&D projects of an exploratory, forward-looking and innovative nature, will also be launched concurrently," the spokesman added.
The spokesman said that by conducting three rounds of project solicitation this year, the Commission aimed to encourage local universities, public research institutes, industry support organisations, trade and industry associations, professional bodies and private sector companies to make use of the ITF funding to undertake applied R&D projects.
The deadline for submitting applications under both Tier 2 and Tier 3 is February 5, 2010.
Details of the technology themes, application guides and procedures are available at (www.itf.gov.hk). Further information can be obtained from the ITF Secretariat at 20/F, Wu Chung House, 213 Queen's Road East, Wan Chai, Hong Kong (tel no: 2737 2229; fax: 2957 8726; email: enquiry@itf.gov.hk).
Ends/Wednesday, December 9, 2009
Issued at HKT 14:35
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