The following is issued on behalf of the Hong Kong Monetary Authority:

     The Hong Kong Monetary Authority, as representative of the Hong Kong Special Administrative Region Government (HKSAR Government), announced that a tender of 5-year RMB institutional Government Bonds through the re-opening of existing Government Bond (issue number 05GB3005001) under the Infrastructure Bond Programme was held today (March 5).

     A total of RMB1.25 billion 5-year Government Bonds were offered today. A total of RMB10.880 billion tender applications were received. The bid-to-cover ratio, i.e. the ratio of bonds applied for to bonds issued, is 8.70. The average price accepted is 101.27, implying an annualised yield of 1.661%.

HKSAR Institutional Government Bonds Tender Results
 
     Tender results of 5-year RMB HKSAR Institutional Government Bonds:
 

Tender Date	:	March 5, 2026
Issue Number	:	05GB3005001 (Re-open)
Stock Code	:	85023 (HKGB1.97 3005-R)
Issue and Settlement Date	:	March 9, 2026
Tenor	:	5 years
Maturity Date	:	May 15, 2030
Coupon Rate	:	1.97 per cent
Amount Applied	:	RMB10.880 billion
Amount Allotted	:	RMB1.25 billion
Bid-to-Cover Ratio*	:	8.70
Average Price Accepted (Yield)	:	101.27 (1.661 per cent (Note))
Lowest Price Accepted (Yield)	:	101.17 (1.686 per cent (Note))
Pro-rata Ratio	:	About 30 per cent
Average Tender Price (Yield)	:	100.91 (1.751 per cent (Note))

* Calculated as the amount of bonds applied for over the amount of bonds issued.

Note: The yields stated above are annualised yields. For reference, the semi-annualised yields corresponding to the average price accepted, lowest price accepted, and average tender price are 1.655 per cent, 1.679 per cent, and 1.743 per cent respectively.

Ends/Thursday, March 5, 2026
Issued at HKT 16:30

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