
Result of tenders of RMB Sovereign Bonds held on February 11, 2026
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The following is issued on behalf of the Hong Kong Monetary Authority:
Result of the tenders of RMB Sovereign Bonds held on February 11, 2026:
| Tender Result | ||
| ********************************************************************* | ||
| Tender Date | : | February 11, 2026 |
| Bonds available for Tender | : | 2-year RMB Bonds |
| Issuer | : | The Ministry of Finance of the People's Republic of China |
| Issue Number | : | BCMKFB26002 |
| Issue and Settlement Date | : | February 13, 2026 |
| Maturity Date | : | February 13, 2028 (or the closest coupon payment date) |
| Application Amount | : | RMB 17,287 million |
| Issue Amount | : | RMB 4,000 million |
| Average accepted Coupon Rate | : | 1.35 per cent |
| Highest accepted Coupon Rate (Bonds' Coupon) |
: | 1.38 per cent |
| Lowest accepted Coupon Rate | : | 1.30 per cent |
| Allocation Ratio (At Highest accepted Coupon Rate) | : | Approximately 26.01 per cent |
| ********************************************************************* | ||
| Tender Date | : | February 11, 2026 |
| Bonds available for Tender | : | 3-year RMB Bonds |
| Issuer | : | The Ministry of Finance of the People's Republic of China |
| Issue Number | : | BCMKFB26003 |
| Issue and Settlement Date | : | February 13, 2026 |
| Maturity Date | : | February 13, 2029 (or the closest coupon payment date) |
| Application Amount | : | RMB 14,607 million |
| Issue Amount | : | RMB 4,000 million |
| Average accepted Coupon Rate | : | 1.38 per cent |
| Highest accepted Coupon Rate (Bonds' Coupon) |
: | 1.40 per cent |
| Lowest accepted Coupon Rate | : | 1.30 per cent |
| Allocation Ratio (At Highest accepted Coupon Rate) | : | Approximately 59.41 per cent |
| ********************************************************************* | ||
| Tender Date | : | February 11, 2026 |
| Bonds available for Tender | : | 5-year RMB Bonds |
| Issuer | : | The Ministry of Finance of the People's Republic of China |
| Issue Number | : | BCMKFB26004 |
| Issue and Settlement Date | : | February 13, 2026 |
| Maturity Date | : | February 13, 2031 (or the closest coupon payment date) |
| Application Amount | : | RMB 12,699 million |
| Issue Amount | : | RMB 3,000 million |
| Average accepted Coupon Rate | : | 1.55 per cent |
| Highest accepted Coupon Rate (Bonds' Coupon) |
: | 1.57 per cent |
| Lowest accepted Coupon Rate | : | 1.45 per cent |
| Allocation Ratio (At Highest accepted Coupon Rate) | : | Approximately 43.58 per cent |
| ********************************************************************* | ||
| Tender Date | : | February 11, 2026 |
| Bonds available for Tender | : | 10-year RMB Bonds |
| Issuer | : | The Ministry of Finance of the People's Republic of China |
| Issue Number | : | BCMKFB26005 |
| Issue and Settlement Date | : | February 13, 2026 |
| Maturity Date | : | February 13, 2036 (or the closest coupon payment date) |
| Application Amount | : | RMB 7,874 million |
| Issue Amount | : | RMB 2,000 million |
| Average accepted Coupon Rate | : | 1.85 per cent |
| Highest accepted Coupon Rate (Bonds’ Coupon) |
: | 1.87 per cent |
| Lowest accepted Coupon Rate | : | 1.75 per cent |
| Allocation Ratio (At Highest accepted Coupon Rate) | : | Approximately 26.00 per cent |
| ********************************************************************* | ||
| Tender Date | : | February 11, 2026 |
| Bonds available for Tender | : | 30-year RMB Bonds |
| Issuer | : | The Ministry of Finance of the People's Republic of China |
| Issue Number | : | BCMKFB26006 |
| Issue and Settlement Date | : | February 13, 2026 |
| Maturity Date | : | February 13, 2056 (or the closest coupon payment date) |
| Application Amount | : | RMB 2,703 million |
| Issue Amount | : | RMB 1,000 million |
| Average accepted Coupon Rate | : | 2.32 per cent |
| Highest accepted Coupon Rate (Bonds' Coupon) |
: | 2.35 per cent |
| Lowest accepted Coupon Rate | : | 2.10 per cent |
| Allocation Ratio (At Highest accepted Coupon Rate) | : | Approximately 53.19 per cent |
Ends/Wednesday, February 11, 2026
Issued at HKT 12:40
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