
GEO to take part in Hong Kong Book Fair 2025
********************************************
​Members of the public are welcome to visit the booth set up by the Geotechnical Engineering Office (GEO) of the Civil Engineering and Development Department at the Hong Kong Book Fair from tomorrow (July 16) to July 22.
There will be display panels introducing information on slope safety and maintenance, and showcasing how GEO leverage innovative technologies to enhance its capability to handle landslides and respond to post-disaster risks.
In addition, visitors can experience a landslide scenario through virtual reality and participate in a virtual tour of the Hong Kong UNESCO Global Geopark. They can also view three-dimensional images to learn about the emergency slope repair works for the Yiu Hing Road landslide in 2023 through a spatial reality display. Publications of the GEO will be available at the booth for reading.
The booth is located at Stall B25 in Hall 1B of the Hong Kong Convention and Exhibition Centre.
Ends/Tuesday, July 15, 2025
Issued at HKT 11:00
NNNN