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Speech by SITI at Innovation and Technology Scholarship 2025 Award Presentation Ceremony (English only) (with photo)
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     Following is the speech by the Secretary for Innovation, Technology and Industry, Professor Sun Dong, at the Innovation and Technology Scholarship 2025 Award Presentation Ceremony today (June 26):

Bernard (Chairman of the Awardee Selection Committee of the Innovation and Technology Scholarship, Mr Bernard Chan), Kenneth (President of the Hong Kong Federation of Youth Groups (HKFYG), Mr Kenneth Chen), Helen (Executive Director of HKFYG, Ms Helen Hsu), Charlotte (Chief Information Officer, Hong Kong, the Hongkong and Shanghai Banking Corporation Limited, Ms Charlotte Wong), Joseph (Chairman of the Innovation and Technology Scholarship Administration Committee, Dr Joseph Lee), distinguished guests, parents, students, ladies and gentlemen,

     Good morning. It is my great pleasure to be here with you all today at the Innovation and Technology Scholarship Award Presentation Ceremony. 

     First of all, may I express my heartfelt congratulations to the 25 outstanding winners of the 2025 Innovation and Technology Scholarship. You all demonstrate remarkable passion in innovation and technology (I&T) and excellence in your academic pursuits. My congratulation also goes to your parents and families. Your unwavering support, encouragement, and care have played a vital role in shaping the success of these young minds.
    
     Since its inception in 2011, the Innovation and Technology Scholarship has reached an exciting milestone – its 15th year, nurturing up to 375 I&T young talents so far. We have witnessed countless Scholarship alumni growing into leaders or experts in their respective fields. Their journeys are a testament to how far drive and determination can take us and I am sure that their stories will inspire more young people to dream big and keep striving.
 
     Hong Kong enjoys a unique advantage of having strong support from the motherland and close connection with the world, converging global innovation resources, including high-calibre talent. With staunch support of our motherland, the Hong Kong Special Administrative Region Government is committed to developing Hong Kong into an International I&T Centre. Tangible progress is already underway. Over the past two years, we have attracted over 200 I&T enterprises with high potential and representativeness to set up or expand their businesses here. Furthermore, the construction of the Hong Kong Park of the Hetao Shenzhen-Hong Kong Science and Technology Innovation Co-operation Zone is in full swing. Expecting move-in from the second half of this year, the Park will serve as a bridgehead for I&T collaboration between the Mainland and Hong Kong.  

     Dear students, you are stepping into a world full of promise. Prepare yourselves to ride the wave of I&T opportunity. This moment is not just about receiving an award – it is the beginning of an incredible journey. I encourage you all to keep up your curiosity for innovation and explore your interested I&T fields, cherish the opportunities brought along by the programmes under the Scholarship, seize every chance to learn from your mentors and grow not only as innovators but also as responsible contributors to our society.
 
     Before closing, I would like to thank the Scholarship's organiser, the Hong Kong Federation of Youth Groups, and the sponsors, the Hongkong and Shanghai Banking Corporation, the Innovation and Technology Commission, as well as members of the two Scholarship Selection Committees, and mentors from all sectors of society for your unfailing support in the past 15 years in nurturing talent together.
 
     As the video we just watched concludes, Let's Make Change For Good! Together, we can shape a future where innovation uplifts lives and empowers generations to come. Thank you very much.
 
Ends/Thursday, June 26, 2025
Issued at HKT 13:22
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Photo

The Secretary for Innovation, Technology and Industry, Professor Sun Dong, speaks at the Innovation and Technology Scholarship 2025 Award Presentation Ceremony today (June 26).