The following is issued on behalf of the Hong Kong Monetary Authority:
 
     The Hong Kong Monetary Authority (HKMA), as representative of the Hong Kong Special Administrative Region Government (HKSAR Government), announced that a tender for 5-year RMB institutional Government Bonds (issue number 05GB3005001) under the Infrastructure Bond Programme was held today (May 13).
      
     A total of RMB1.5 billion 5-year Government Bonds were offered today. A total of RMB10.753 billion tender applications were received. The bid-to-cover ratio, i.e. the ratio of bonds applied for to bonds issued, is 7.17. The average price accepted is 101.46, implying an annualised yield of 1.672 per cent.

HKSAR Institutional Government Bonds Tender Results
 
     Tender results of 5-year RMB HKSAR Institutional Government Bonds:
 

Tender Date	:	May 13, 2025
Issue Number	:	05GB3005001
Stock Code	:	85023 (HKGB1.97 3005-R)
Issue and Settlement Date	:	May 15, 2025
Tenor	:	5 years
Maturity Date	:	May 15, 2030
Coupon Rate	:	1.97 per cent
Amount Applied	:	RMB10.753 billion
Amount Allotted	:	RMB1.5 billion
Bid-to-Cover Ratio*	:	7.17
Average Price Accepted (Yield)	:	101.46 (1.672 per cent (Note))
Lowest Price Accepted (Yield)	:	100.98 (1.772 per cent (Note))
Pro-rata Ratio	:	About 100 per cent
Average Tender Price (Yield)	:	100.23 (1.930 per cent (Note))

* Calculated as the amount of bonds applied for over the amount of bonds issued.

Note: The yields stated above are annualised yields. For reference, the semi-annualised yields corresponding to the average price accepted, lowest price accepted, and average tender price are 1.665 per cent, 1.764 per cent, and 1.921 per cent respectively.

Ends/Tuesday, May 13, 2025
Issued at HKT 17:25

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