The following is issued on behalf of the Hong Kong Monetary Authority:

     Result of tenders of RMB Sovereign Bonds held on June 14, 2023:
 

Tender Result
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Tender Date	:	June 14, 2023
Bonds available for Tender	:	2-year RMB Bonds
Issue Number	:	BCMKFB23013
Issue and Settlement Date	:	June 16, 2023
Maturity Date	:	June 16, 2025 (or the closest coupon payment date)
Application Amount	:	RMB 21,739 million
Issue Amount	:	RMB 6,000 million
Average accepted Coupon Rate	:	2.16 per cent
Highest accepted Coupon Rate (Bonds' Coupon)	:	2.20 per cent
Lowest accepted Coupon Rate	:	1.60 per cent
Allocation Ratio	:	Approximately 96.29 per cent

 

Tender Result
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Tender Date	:	June 14, 2023
Bonds available for Tender	:	3-year RMB Bonds
Issue Number	:	BCMKFB23014
Issue and Settlement Date	:	June 16, 2023
Maturity Date	:	June 16, 2026 (or the closest coupon payment date)
Application Amount	:	RMB 18,062 million
Issue Amount	:	RMB 4,000 million
Average accepted Coupon Rate	:	2.22 per cent
Highest accepted Coupon Rate (Bonds' Coupon)	:	2.30 per cent
Lowest accepted Coupon Rate	:	1.60 per cent
Allocation Ratio	:	Approximately 68.43 per cent

 

Tender Result
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Tender Date	:	June 14, 2023
Bonds available for Tender	:	10-year RMB Bonds
Issue Number	:	BCMKFB23015
Issue and Settlement Date	:	June 16, 2023
Maturity Date	:	June 16, 2033 (or the closest coupon payment date)
Application Amount	:	RMB 10,224 million
Issue Amount	:	RMB 2,000 million
Average accepted Coupon Rate	:	2.65 per cent
Highest accepted Coupon Rate (Bonds' Coupon)	:	2.71 per cent
Lowest accepted Coupon Rate	:	2.30 per cent
Allocation Ratio	:	Approximately 37.78 per cent

Ends/Wednesday, June 14, 2023
Issued at HKT 14:10

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