SCED visits Beijing (with photos)
Accompanied by the Director of Intellectual Property, Mr David Wong, Mr Yau met with the Commissioner of the CNIPA, Dr Shen Changyu, this morning. Mr Yau said that under the auspices of the National 14th Five-Year Plan in supporting Hong Kong to develop into a regional intellectual property (IP) trading centre, the Hong Kong Special Administrative Region Government (HKSARG) has been committed to protecting IP rights and promoting IP trading, in line with the national strategy to develop IP.
Mr Yau thanked the CNIPA for its support to the HKSARG all along. The CNIPA and the Commerce and Economic Development Bureau signed the Co-operation Arrangement in the Area of Intellectual Property in June 2017, and have agreed to extend the Arrangement to June 2027 for further collaboration in grasping the new opportunities in IP arising from the national strategy of building an IP powerhouse. In addition, the CNIPA has been providing technical assistance to the Intellectual Property Department in patent examiner training and substantive patent examination. A pilot project was also launched on January 1 this year for prioritising examination of qualified invention patent applications filed by Hong Kong applicants on the Mainland.
Mr Yau then met with the Director General of the State Post Bureau, Mr Zhao Chongjiu, to discuss further collaboration, as accompanied by the Postmaster General, Miss Leonia Tai.
Mr Yau said that in order to seize the opportunities brought about by the Guangdong-Hong Kong-Macao Greater Bay Area (GBA) development, Hongkong Post will leverage the advantages of Hong Kong's logistics network and vigorously promote cross-boundary delivery services, in particular e-commerce products, to strengthen economic development. Hongkong Post is also pressing ahead with the redevelopment of Hong Kong's Air Mail Centre and will utilise its cold chain logistics facilities to develop cross-boundary premium logistics business in the GBA.
Mr Yau will return to Hong Kong this evening.
Ends/Wednesday, April 19, 2023
Issued at HKT 16:00
Issued at HKT 16:00