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Tender of 15-year Government Bonds under Institutional Bond Issuance Programme to be held on January 11, 2023
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The following is issued on behalf of the Hong Kong Monetary Authority:

     The Hong Kong Monetary Authority (HKMA), as representative of the Hong Kong Special Administrative Region Government (HKSAR Government), announced today (December 30) that a tender of 15-year Government Bonds (Bonds) under the Institutional Bond Issuance Programme will be held on January 11, 2023 (Wednesday), for settlement on January 12, 2023 (Thursday).

     A total of HK$1.0 billion 15-year Bonds will be tendered. The Bonds will mature on January 12, 2038, and will carry interest at the rate of 3.74 per cent per annum payable semi-annually in arrears.

     Under the Institutional Bond Issuance Programme, tender is open only to Recognized Dealers which are appointed as Primary Dealers. Anyone wishing to apply for the Bonds on offer can do so through any of the Primary Dealers on the current published list, which can be obtained from the Hong Kong Government Bonds website at www.hkgb.gov.hk. Each tender must be for an amount of HK$50,000 or integral multiples thereof.

     Tender results will be published on the HKMA's website, the Hong Kong Government Bonds website, the Refinitiv screen (HKGBINDEX), and Bloomberg (GBHK <GO>) not later than 3pm on the tender day.
 
HKSAR Government Institutional Bond Issuance Programme Tender Information
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Tender information of 15-year Government Bonds under the Institutional Bond Issuance Programme:
 
Issue Number : 15GB3801 
Stock code : 4258 (HKGB 3.74 3801) 
Tender Date and Time : January 11, 2023 (Wednesday)
9.30am to 10.30am 
Issue and Settlement Date for tender amount  : January 12, 2023 (Thursday)
Amount on Offer  : HK$1.0 billion
Maturity  : 15 years
Maturity Date : January 12, 2038 
Interest Rate : 3.74% p.a. payable semi-annually in arrears 
Interest Payment Dates  : July 12, 2023
January 12, 2024
July 12, 2024
January 13, 2025
July 14, 2025
January 12, 2026
July 13, 2026
January 12, 2027
July 12, 2027
January 12, 2028
July 12, 2028
January 12, 2029
July 12, 2029
January 14, 2030
July 12, 2030
January 13, 2031
July 14, 2031
January 12, 2032
July 12, 2032
January 12, 2033
July 12, 2033
January 12, 2034
July 12, 2034
January 12, 2035
July 12, 2035
January 14, 2036
July 14, 2036
January 12, 2037
July 13, 2037
January 12, 2038
Method of Tender : Competitive tender 
Tender Amount : Each competitive tender must be for an amount of HK$50,000 or integral multiples thereof. Any tender applications for the Bonds must be submitted through a Primary Dealer on the current published list. 
Other details  : Please see Information Memorandum available on the Hong Kong Government Bonds website at www.hkgb.gov.hk or approach Primary Dealers. 
Expected commencement date of dealing on
the Stock Exchange
of Hong Kong Limited
: January 13, 2023
 
Price/Yield Table of the Government Bonds at tender for reference* only:
 
Yield-to-Maturity Price Yield-to-Maturity Price
2.740 112.48 3.740 100.39
2.790 111.83 3.790 99.83
2.840 111.19 3.840 99.28
2.890 110.55 3.890 98.72
2.940 109.92 3.940 98.17
2.990 109.29 3.990 97.63
3.040 108.67 4.040 97.09
3.090 108.05 4.090 96.55
3.140 107.44 4.140 96.02
3.190 106.82 4.190 95.49
3.240 106.22 4.240 94.96
3.290 105.62 4.290 94.44
3.340 105.02 4.340 93.92
3.390 104.43 4.390 93.41
3.440 103.84 4.440 92.89
3.490 103.25 4.490 92.39
3.540 102.67 4.540 91.88
3.590 102.10 4.590 91.38
3.640 101.52 4.640 90.88
3.690 100.96 4.690 90.39
3.740 100.39 4.740 89.90
 
* Disclaimer: The information provided here is for reference only. Although extreme care has been taken to ensure that the information provided is accurate and up-to-date, the HKMA does not warrant that all, or any part of, the information provided is accurate in all respects. You are encouraged to conduct your own enquiries to verify any particular piece of information provided on it. The HKMA shall not be liable for any loss or damage suffered as a result of any use or reliance on any of the information provided here.
 
Ends/Friday, December 30, 2022
Issued at HKT 16:30
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