SITI briefs stakeholders on Policy Address I&T initiatives (with photos)

     The Secretary for Innovation, Technology and Industry, Professor Sun Dong, today (November 1) briefed the innovation and technology (I&T) sector, professional bodies, academic associations and research clusters on I&T initiatives outlined in "The Chief Executive's 2022 Policy Address".

     Professor Sun said that the National 14th Five-Year Plan expressed clear support for Hong Kong to develop into an international I&T hub. This year's Policy Address fully implements the National 14th Five-Year Plan's vision in supporting Hong Kong to develop into an international I&T hub. The Government will promulgate the Hong Kong I&T Development Blueprint within this year to set out major policies under four development directions:
(i) To enhance the I&T ecosystem and achieve re-industrialisation in Hong Kong;
(ii) To enlarge the I&T talent pool to create strong impetus for growth;
(iii) To develop Hong Kong into a smart city to improve the quality of life of people; and
(iv) To proactively integrate into the overall development of the country and consolidate Hong Kong's advantages as an international city.
     Professor Sun highlighted the launch of the $10 billion "Research, Academic and Industry Sectors One-plus Scheme" (RAISe+ Scheme), which aims to incentivise collaboration among industry, academic and research sectors to further promote the "1 to N" transformation and realisation of research and development (R&D) outcomes and industry development. Focusing on industries of strategic importance, such as life and health technology, artificial intelligence and data science, as well as advanced manufacturing and new energy technology, high-potential or representative I&T enterprises will be proactively attracted from around the globe by collaborating with the Office for Attracting Strategic Enterprises and making use of the Strategic Tech Fund and the Co-Investment Fund. The Innovation, Technology and Industry Bureau will create the post of Commissioner for Industry, and subsidises the setting up of more smart production lines in Hong Kong under the Re-industrialisation Funding Scheme, with the aim of increasing the cumulative number by four times to over 130 in five years. He also called on the participants to join hands to attract enterprises interested in expanding their businesses in Hong Kong by leveraging their Mainland and overseas connections, with a view to driving the development of the local industry.
     The Policy Address also announced the enhancement of the Technology Talent Admission Scheme by expanding the coverage to more emerging technology areas to facilitate the admission of technology talents from the advanced manufacturing industry. In addition, the Government will use the Hong Kong-Shenzhen Innovation and Technology Park in the Lok Ma Chau Loop as a pilot to study the trial implementation of a cross-boundary policy on I&T co-operation with Shenzhen on the basis of "one zone, two parks".
     Professor Sun said that at the recently concluded 20th National Congress of the Communist Party of China, General Secretary Xi Jinping pointed out that the country will fully implement the strategy for invigorating China through science and education, the workforce development strategy, and the innovation-driven development strategy, with a view to improving systems for scientiļ¬c and technological innovation and building world hubs for talent and innovation. Through formulation of clear development direction and strategies as well as enhanced co-ordination and planning of relevant measures, Professor Sun hoped to spearhead the promotion of I&T development at full speed to live up to the expectations of the country.
     Jointly organised by the Hong Kong Cyberport Management Company Limited, the Hong Kong Science and Technology Parks Corporation and the office of Legislative Council Member Mr Duncan Chiu, the seminar was held in person and online, as well as live-streamed in Shenzhen, Guangzhou and Foshan sub-venues.

Ends/Tuesday, November 1, 2022
Issued at HKT 19:20