CEDB's internship programmes for youth achieving good progress
The five newly-joined chambers of commerce are the Italian Chamber of Commerce in Hong Kong and Macao, the Dutch Chamber of Commerce in Hong Kong, the Swiss Chamber of Commerce in Hong Kong, the Australian Chamber of Commerce in Hong Kong and the American Chamber of Commerce in Hong Kong.
In January this year, the CEDB launched the FIT programme and another internship programme, the Telecommunications Opportunities Programme (TOP), in collaboration with six international chambers of commerce in Hong Kong and the Hong Kong Federation of Youth Groups (HKFYG) respectively to create full-time entry-level job opportunities for young people in the creative industries and telecommunications sectors. Under the two programmes, the Government provides monthly salary subsidies under the Job Creation Scheme funded by the Anti-epidemic Fund at $5,610 per fresh graduate or to-be graduate with no work experience and $10,000 for young people with no more than five years of work experience, for a maximum of 12 months.
"FIT and TOP provide much-needed job opportunities for our young people at this difficult time, offering them global perspectives and wider exposure through work. Thanks to the support and collaboration of the participating partner chambers and the HKFYG, the two programmes are proceeding well and making very good progress," the Secretary for Commerce and Economic Development, Mr Edward Yau, said today (March 18).
"I am delighted to have five new partner chambers on board for FIT. I am confident that their comprehensive networks and knowledge of the trade will add to the success of the programme," he said.
At present, 92 member companies of the existing partner chambers (viz. the British Chamber of Commerce in Hong Kong; the Canadian Chamber of Commerce in Hong Kong; the French Chamber of Commerce and Industry in Hong Kong; the German Chamber of Commerce, Hong Kong; the Hong Kong Japanese Chamber of Commerce & Industry; and the Swedish Chamber of Commerce in Hong Kong) have offered a total of 160 job and internship positions. The companies concerned are now preparing for their respective recruitment exercises. For the new participating chambers, the CEDB has opened a second round of applications for their member companies ending on March 31 with a view to announcing the results by mid-April 2021 and commencing recruitment thereafter.
The TOP programme is also achieving good progress since its launch. With the smooth execution by the HKFYG and support from over ten telecommunications-related companies, some 120 job vacancies in the telecommunications sector have been created so far. The participating companies are now conducting recruitment exercises and interns are expected to commence work from April 2021.
Ends/Thursday, March 18, 2021
Issued at HKT 10:00
Issued at HKT 10:00