EDB to launch new round of E-APP applications tomorrow
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A spokesman for the EDB said "The E-APP is a free electronic application platform. Applicants may complete one application via the E-APP to apply for most post-secondary programmes that are not covered under the JUPAS. Relevant institutions will process applications from the E-APP as early as possible and may give eligible candidates conditional offers before the announcement of HKDSE Examination results."
The main round of E-APP applications will run from tomorrow until May 23, 2021, and the second round of applications will last from May 28 to July 12, 2021. In general, institutions will first process applications received in the main round.
"Before applying via the E-APP, students may browse the Concourse for Self-financing Post-secondary Education website (www.cspe.edu.hk), which provides information on post-secondary institutions and details of about 450 full-time locally accredited higher diploma, associate degree and undergraduate programmes that are not covered under the JUPAS for the 2021/22 academic year, including their tuition fees, entry requirements, and accreditation and recognition by relevant professional bodies. Institutions' estimated numbers of intake places, their application and admission arrangements for the 2021/22 academic year as well as their past admission scores and graduate statistics will also be uploaded onto the Concourse," the spokesman said.
The Concourse will also provide information on full-time University Grants Committee-funded undergraduate programmes offering senior year places, and self-financing top-up degree programmes in the 2021/22 academic year, so as to help graduates and students of sub-degree programmes plan their further studies.
Ends/Wednesday, December 9, 2020
Issued at HKT 11:00
Issued at HKT 11:00
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