The following is issued on behalf of the Hong Kong Monetary Authority:

     Result of the tenders of RMB Sovereign Bonds held on June 20, 2019:
 

Tender Result
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Tender Date	:	June 20, 2019
Bonds available for Tender	:	2-year RMB Bonds
Issue Number	:	BCMKFB19023
Issue Date	:	June 24, 2019
Maturity Date	:	June 24, 2021 (or the closest coupon payment date)
Application Amount	:	RMB 11,243 million
Issue Amount	:	RMB 3,500 million
Average accepted Coupon Rate	:	2.79 per cent
Highest accepted Coupon Rate
(Bonds' Coupon)	:	2.95 per cent
Lowest accepted Coupon Rate	:	2.50 per cent
Allocation Ratio	:	Approximately 1.51 per cent

 

Tender Result
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Tender Date	:	June 20, 2019
Bonds available for Tender	:	5-year RMB Bonds
Issue Number	:	BCMKFB19024
Issue Date	:	June 24, 2019
Maturity Date	:	June 24, 2024 (or the closest coupon payment date)
Application Amount	:	RMB 4,387 million
Issue Amount	:	RMB 1,000 million
Average accepted Coupon Rate	:	2.92 per cent
Highest accepted Coupon Rate
(Bonds' Coupon)	:	3.03 per cent
Lowest accepted Coupon Rate	:	2.70 per cent
Allocation Ratio	:	Approximately 42.96 per cent

Ends/Thursday, June 20, 2019
Issued at HKT 15:18

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