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Result of the tenders of RMB Sovereign Bonds held on June 29, 2016
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The following is issued on behalf of the Hong Kong Monetary Authority:

Tender Date                  : June 29, 2016

Bonds available for Tender   : 3-year RMB Bonds

Issue Number                 : BCMKFB16011

Issue Date                   : July 4, 2016

Maturity Date                : July 4, 2019
                               (or the closest
                               coupon payment date)

Application Amount           : RMB 24,456 million

Issue Amount                 : RMB 7,000 million

Average accepted Coupon Rate : 2.79 %

Highest accepted Coupon Rate : 2.90 %
(Bonds' Coupon)

Lowest accepted Coupon Rate  : 1.80 %

Allocation Ratio             : Approximately 54.71 %

*****************************************************

Tender Date                  : June 29, 2016

Bonds available for Tender   : 5-year RMB Bonds

Issue Number                 : BCMKFB16012

Issue Date                   : July 4, 2016

Maturity Date                : July 4, 2021
                               (or the closest
                               coupon payment date)

Application Amount           : RMB 11,851 million

Issue Amount                 : RMB 4,500 million

Average accepted Coupon Rate : 3.12 %

Highest accepted Coupon Rate : 3.25 %
(Bonds' Coupon)

Lowest accepted Coupon Rate  : 2.00 %

Allocation Ratio             : Approximately 9.48 %

****************************************************

Tender Date                  : June 29, 2016

Bonds available for Tender   : 7-year RMB Bonds

Issue Number                 : BCMKFB16013

Issue Date                   : July 4, 2016

Maturity Date                : July 4, 2023
                               (or the closest
                               coupon payment date)

Application Amount           : RMB 3,169.5 million

Issue Amount                 : RMB 1,000 million

Average accepted Coupon Rate : 3.21 %

Highest accepted Coupon Rate : 3.30 %
(Bonds' Coupon)

Lowest accepted Coupon Rate  : 2.50 %

Allocation Ratio             : Approximately 43.35 %

****************************************************

Tender Date                  : June 29, 2016

Bonds available for Tender   : 10-year RMB Bonds

Issue Number                 : BCMKFB16014

Issue Date                   : July 4, 2016

Maturity Date                : July 4, 2026
                               (or the closest
                               coupon payment date)

Application Amount           : RMB 3,680 million

Issue Amount                 : RMB 1,000 million

Average accepted Coupon Rate : 3.30 %

Highest accepted Coupon Rate : 3.38 %
(Bonds' Coupon)

Lowest accepted Coupon Rate  : 3.00 %

Allocation Ratio             : Approximately 35.00 %

*****************************************************

Tender Date                  : June 29, 2016

Bonds available for Tender   : 20-year RMB Bonds

Issue Number                 : BCMKFB16015

Issue Date                   : July 4, 2016

Maturity Date                : July 4, 2036
                               (or the closest
                               coupon payment date)

Application Amount           : RMB 1,311 million

Issue Amount                 : RMB 500 million

Average accepted Coupon Rate : 3.81 %

Highest accepted Coupon Rate : 3.90 %
(Bonds' Coupon)

Lowest accepted Coupon Rate  : 3.50 %

Allocation Ratio             : Approximately 96.55 %

Ends/Wednesday, June 29, 2016
Issued at HKT 15:45

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