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2015 Innovation and Technology Fund open for applications

     The Innovation and Technology Commission (ITC) is now inviting funding applications under the Innovation and Technology Support Programme (ITSP) of the Innovation and Technology Fund (ITF).

     The ITSP adopts a three-tier funding framework. This application exercise covers Tier 2 and Tier 3 funding.  Tier 2 involves the funding of applied R&D projects that are industry-oriented and have potential for commercialisation, while Tier 3 involves the funding of exploratory and forward-looking projects. Application forms and the Application Guide are available at

     "For this round we would in particular like to receive proposals under the themes of 'Elderly' and 'Technologies for Financial Services and E-commerce'. However, proposals not falling under these two themes would also be accepted," a spokesman for the ITC said.

     The application period commenced today (July 31) and will last until September 30 this year.

     Further information on the ITSP funding schemes and application procedures is available on the ITF website and can be obtained from the ITF Secretariat at 21/F, West Wing, Central Government Offices, 2 Tim Mei Avenue, Tamar, Hong Kong (tel: 3655 5725; fax: 2957 8726; email:

Ends/Friday, July 31, 2015
Issued at HKT 11:01


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