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The following is issued on behalf of the Hong Kong Monetary Authority:
Tender Date : November 21, 2013
Bonds available for Tender : Three-year RMB Bonds
Issue Number : BCMKFB13068
Issue Date : November 22, 2013
Maturity Date : November 22, 2016
(or the closest
Coupon payment date)
Application Amount : RMB 20,542 million
Issue Amount : RMB 5,000 million
Average accepted Coupon Rate : 2.48%
Highest accepted Coupon Rate
(Bonds' Coupon) : 2.60%
Lowest accepted Coupon Rate : 2.00%
Allocation Ratio : Approximately 26.79%
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Tender Date : November 21, 2013
Bonds available for Tender : Five-year RMB Bonds
Issue Number : BCMKFB13069
Issue Date : November 22, 2013
Maturity Date : November 22, 2018
(or the closest
Coupon payment date)
Application Amount : RMB 5,363 million
Issue Amount : RMB 2,000 million
Average accepted Coupon Rate : 2.92%
Highest accepted Coupon Rate
(Bonds' Coupon) : 3.09%
Lowest accepted Coupon Rate : 2.00%
Allocation Ratio : Approximately 1.22%
Ends/Thursday, November 21, 2013
Issued at HKT 15:09
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