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The Innovation and Technology Commission (ITC) is now inviting the second round of funding applications under Tier 2 and Tier 3 of the Innovation and Technology Support Programme (ITSP) of the Innovation and Technology Fund (ITF).
The ITSP adopts a three-tier funding framework. This round of application covers Tier 2 and Tier 3 funding. Tier 2 involves the funding of applied R&D projects that are industry-oriented and have potential for commercialisation, while Tier 3 involves the funding of exploratory and forward-looking R&D projects. Application forms and the application guide are available at www.itf.gov.hk.
"For this round we would in particular like to receive proposals under the themes of 'Elderly' or 'Green Technology'. However, proposals not falling under these two themes would also be accepted," a spokesman for the ITC said.
The application period commenced today (August 6) and will last until September 30 this year.
Further information on the ITSP funding schemes and application procedures are available on the ITF website and can also be obtained from the ITF Secretariat at 21/F, West Wing, Central Government Offices, 2 Tim Mei Avenue, Tamar, Hong Kong (tel: 3655 5725; fax: 2957 8726; email: enquiry@itf.gov.hk).
Ends/Tuesday, August 6, 2013
Issued at HKT 18:51
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