Result of the tenders of RMB Sovereign Bonds held on June 26, 2013
**********************************************************

The following is issued on behalf of the Hong Kong Monetary Authority:

Tender Date                   : June 26, 2013

Bonds available for Tender    : Three-year RMB Bonds

Issue Number                  : BCMKFB13041

Issue Date                    : June 27, 2013

Maturity Date                 : June 27, 2016
                                (or the closest
                                Coupon payment date)

Application Amount            : RMB 10,683 million

Issue Amount                  : RMB  5,000 million

Average accepted Coupon Rate  : 2.71%

Highest accepted Coupon Rate
(Bonds' Coupon)               : 2.87%

Lowest accepted Coupon Rate   : 1.00%

Allocation Ratio              : Approximately 63.07%

*****************************************************

Tender Date                   : June 26, 2013

Bonds available for Tender    : Five-year RMB Bonds
 
Issue Number                  : BCMKFB13042

Issue Date                    : June 27, 2013

Maturity Date                 : June 27, 2018
                                (or the closest
                                Coupon payment date)

Application Amount            : RMB 4,838 million

Issue Amount                  : RMB 2,000 million

Average accepted Coupon Rate  : 2.83%

Highest accepted Coupon Rate
(Bonds' Coupon)               : 3.02%

Lowest accepted Coupon Rate   : 1.00%

Allocation Ratio              : Approximately 23.38%
 
*****************************************************

Tender Date                   : June 26, 2013

Bonds available for Tender    : Seven-year RMB Bonds

Issue Number                  : BCMKFB13043

Issue Date                    : June 27, 2013

Maturity Date                 : June 29, 2020
                               (or the closest
                                Coupon payment date)

Application Amount            : RMB 2,764.5 million

Issue Amount                  : RMB 1,000 million

Average accepted Coupon Rate  : 2.94%

Highest accepted Coupon Rate
(Bonds' Coupon)               : 3.09%

Lowest accepted Coupon Rate   : 1.00%

Allocation Ratio              : Approximately 99.92%
 
*****************************************************

Tender Date                   : June 26, 2013

Bonds available for Tender    : Ten-year RMB Bonds

Issue Number                  : BCMKFB13044

Issue Date                    : June 27, 2013

Maturity Date                 : June 27, 2023
                               (or the closest
                                Coupon payment date)

Application Amount            : RMB 2,127 million

Issue Amount                  : RMB 1,000 million

Average accepted Coupon Rate  : 3.01%

Highest accepted Coupon Rate
(Bonds' Coupon)               : 3.16%

Lowest accepted Coupon Rate   : 1.00%

Allocation Ratio              : Approximately 90.34%
 
*****************************************************

Tender Date                   : June 26, 2013

Bonds available for Tender    : Fifteen-year
                                RMB Bonds

Issue Number                  : BCMKFB13045

Issue Date                    : June 27, 2013

Maturity Date                 : June 27, 2028
                               (or the closest
                                Coupon payment date)

Application Amount            : RMB 1,248 million

Issue Amount                  : RMB 500 million

Average accepted Coupon Rate  : 3.40%

Highest accepted Coupon Rate
(Bonds' Coupon)               : 3.60%

Lowest accepted Coupon Rate   : 1.00%

Allocation Ratio              : Approximately 57.05%
 
*****************************************************

Tender Date                   : June 26, 2013

Bonds available for Tender    : Thirty-year RMB Bonds

Issue Number                  : BCMKFB13046

Issue Date                    : June 27, 2013

Maturity Date                 : June 29, 2043
                               (or the closest
                                Coupon payment date)

Application Amount            : RMB 1,025 million

Issue Amount                  : RMB 500 million

Average accepted Coupon Rate  : 3.85%

Highest accepted Coupon Rate
(Bonds' Coupon)               : 3.95%

Lowest accepted Coupon Rate   : 1.00%

Allocation Ratio              : Approximately 88.75%

Ends/Wednesday, June 26, 2013
Issued at HKT 14:21

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