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LegCo Panel on Commerce and Industry to depart for Israel to conduct duty visit
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The following is issued on behalf of the Legislative Council Secretariat:

     At the invitation of the Consul General of Israel in Hong Kong Special Administrative Region and Macau Special Administrative Region, the delegation of the Legislative Council (LegCo) Panel on Commerce and Industry will depart for Israel tonight (July 22) to conduct a five-day overseas duty visit.

     The purpose of the duty visit is for Members to study Israel's policies, initiatives and legislations relevant to the promotion of the development of innovation and technology (I&T) industry as well as re-industrialization.  In addition, members of the delegation will also take the opportunity to meet and exchange views with relevant government authorities involved in the formulation, implementation and monitoring of policies on I&T, as well as representatives of technology transfer companies affiliated with leading universities, other high technology organizations and startups.

     During the visit from July 23 to 27 (Sunday to Thursday) in Israel, the delegation will visit the following organizations and places:
 
  • Israel Ministry of Foreign Affairs
  • Israel Ministry of Economy
  • Israel Innovation Authority
  • Knesset (Israeli Parliament)
  • The Hebrew University of Jerusalem and its technology transfer company – Yissum Research and Development
  • Tel Aviv University and its technology transfer company – Ramot
  • Jerusalem Venture Partners
  • Sorek Desalination Plant
  • Multinational corporations
  • a leading provider of high technology library automation solutions – Ex Libris

     The delegation is led by the delegation leader Mr Wu Chi-wai, who is also the Chairman of the LegCo Panel on Commerce and Industry.  Other participating Members include Panel members Mr Paul Tse, Mr Ma Fung-kwok, Mr Charles Mok, Dr Lo Wai-kwok and Mr Chung Kwok-pan, as well as non-Panel members Dr Helena Wong, Mr Alvin Yeung and Dr Junius Ho.
 
Ends/Saturday, July 22, 2017
Issued at HKT 18:00
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