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BCCL and HKMA promote Bond Connect
The following is issued on behalf of the Hong Kong Monetary Authority:

     Bond Connect Company Limited (BCCL), a joint venture of China Foreign Exchange Trade System (CFETS) and Hong Kong Exchanges and Clearing Limited (HKEX) formed to support Bond Connect, a new mutual market access programme for bonds between Hong Kong and Mainland China, co-hosted an investor forum on the programme today (July 3) with the Hong Kong Monetary Authority (HKMA).

     The Bond Connect Investor Forum kicked off efforts to increase investor awareness of the new programme, promote the programme's benefits and highlight potential opportunities in the bond market.

     The forum was held at HKEX and was part of the launch event for Bond Connect.  The launch event also included a ceremony marking the start of BCCL's operations.
     The forum began with opening addresses by the Chief Executive of HKEX, Mr Charles Li.  They were followed by keynote speeches by the Deputy Governor of the People's Bank of China, Mr Pan Gongsheng and the Deputy Chief Executive of the HKMA, Mr Eddie Yue.  There were also three panel discussions and a Questions and Answers session. 
     "Bond Connect marks another milestone of mutual access of capital markets between the Mainland and Hong Kong.  It is also another important measure of the Central Government to support Hong Kong's development as an international financial centre.  Bond Connect is a new financial infrastructure established through the connection between HKMA's Central Moneymarkets Unit and the relevant central securities depositories on the Mainland.  We believe that with the convenience and flexibility provided by Bond Connect, overseas investors' participation in the Mainland bond market would be enhanced," said the Chief Executive of the HKMA, Mr Norman Chan.

     "We were pleased by the good attendance and will continue to reach out to potential Bond Connect participants," said the Chairman of BCCL, Ms Zhang Cuiwei.  "We have been encouraged by all the interest in Bond Connect and were glad to hear the positive feedback we received today."

     Approximately 500 people attended the forum.
Ends/Monday, July 3, 2017
Issued at HKT 19:31
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