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The following is issued on behalf of the Hong Kong Monetary Authority:
Tender Date : November 20, 2014
Bonds available for Tender : 3-year RMB Bonds
Issue Number : BCMKFB14092
Issue Date : November 21, 2014
Maturity Date : November 21, 2017
(or the closest
coupon payment date)
Application Amount : RMB 17,293 million
Issue Amount : RMB 4,000 million
Average accepted Coupon Rate : 2.66%
Highest accepted Coupon Rate : 2.74%
(Bonds' Coupon)
Lowest accepted Coupon Rate : 2.20%
Allocation Ratio : Approximately 78.00%
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Tender Date : November 20, 2014
Bonds available for Tender : 5-year RMB Bonds
Issue Number : BCMKFB14093
Issue Date : November 21, 2014
Maturity Date : November 21, 2019
(or the closest
coupon payment date)
Application Amount : RMB 8,969 million
Issue Amount : RMB 3,000 million
Average accepted Coupon Rate : 2.91%
Highest accepted Coupon Rate : 3.00%
(Bonds' Coupon)
Lowest accepted Coupon Rate : 2.40%
Allocation Ratio : Approximately 46.55%
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Tender Date : November 20, 2014
Bonds available for Tender : 10-year RMB Bonds
Issue Number : BCMKFB14094
Issue Date : November 21, 2014
Maturity Date : November 21, 2024
(or the closest
coupon payment date)
Application Amount : RMB 7,701 million
Issue Amount : RMB 2,000 million
Average accepted Coupon Rate : 3.28%
Highest accepted Coupon Rate : 3.38%
(Bonds' Coupon)
Lowest accepted Coupon Rate : 3.00%
Allocation Ratio : Approximately 7.69%
Ends/Thursday, November 20, 2014
Issued at HKT 17:07
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