************************************************************
The following is issued on behalf of the Hong Kong Monetary Authority:
Tender Date : May 21, 2014
Bonds available for Tender : 3-year RMB Bonds
Issue Number : BCMKFB14042
Issue Date : May 22, 2014
Maturity Date : May 22, 2017
(or the closest
coupon payment date)
Application Amount : RMB 23,392 million
Issue Amount : RMB 7,000 million
Average accepted Coupon Rate : 2.40%
Highest accepted Coupon Rate : 2.53%
(Bonds' Coupon)
Lowest accepted Coupon Rate : 2.00%
Allocation Ratio : Approximately 7.45%
*****************************************************
Tender Date : May 21, 2014
Bonds available for Tender : 5-year RMB Bonds
Issue Number : BCMKFB14043
Issue Date : May 22, 2014
Maturity Date : May 22, 2019
(or the closest
coupon payment date)
Application Amount : RMB 11,431 million
Issue Amount : RMB 4,000 million
Average accepted Coupon Rate : 3.03%
Highest accepted Coupon Rate : 3.25%
(Bonds' Coupon)
Lowest accepted Coupon Rate : 2.75%
Allocation Ratio : Approximately 0.41%
*****************************************************
Tender Date : May 21, 2014
Bonds available for Tender : 7-year RMB Bonds
Issue Number : BCMKFB14044
Issue Date : May 22, 2014
Maturity Date : May 22, 2021
(or the closest
coupon payment date)
Application Amount : RMB 2,431 million
Issue Amount : RMB 1,000 million
Average accepted Coupon Rate : 3.74%
Highest accepted Coupon Rate : 3.80%
(Bonds' Coupon)
Lowest accepted Coupon Rate : 3.25%
Allocation Ratio : Approximately 73.49%
*****************************************************
Tender Date : May 21, 2014
Bonds available for Tender : 10-year RMB Bonds
Issue Number : BCMKFB14045
Issue Date : May 22, 2014
Maturity Date : May 22, 2024
(or the closest
coupon payment date)
Application Amount : RMB 2,579 million
Issue Amount : RMB 1,000 million
Average accepted Coupon Rate : 3.91%
Highest accepted Coupon Rate : 4.00%
(Bonds' Coupon)
Lowest accepted Coupon Rate : 3.65%
Allocation Ratio : Approximately 8.83%
*****************************************************
Tender Date : May 21, 2014
Bonds available for Tender : 15-year RMB Bonds
Issue Number : BCMKFB14046
Issue Date : May 22, 2014
Maturity Date : May 22, 2029
(or the closest
coupon payment date)
Application Amount : RMB 1,102 million
Issue Amount : RMB 500 million
Average accepted Coupon Rate : 4.17%
Highest accepted Coupon Rate : 4.29%
(Bonds' Coupon)
Lowest accepted Coupon Rate : 3.85%
Allocation Ratio : Approximately 5.00%
*****************************************************
Tender Date : May 21, 2014
Bonds available for Tender : 20-year RMB Bonds
Issue Number : BCMKFB14047
Issue Date : May 22, 2014
Maturity Date : May 22, 2034
(or the closest
coupon payment date)
Application Amount : RMB 1,006 million
Issue Amount : RMB 500 million
Average accepted Coupon Rate : 4.38%
Highest accepted Coupon Rate : 4.50%
(Bonds' Coupon)
Lowest accepted Coupon Rate : 4.00%
Allocation Ratio : Approximately 42.75%
Ends/Wednesday, May 21, 2014
Issued at HKT 13:55
NNNN
