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The Innovation and Technology Commission is now inviting funding applications under the Innovation and Technology Support Programme (ITSP) of the Innovation and Technology Fund (ITF).
The ITSP adopts a three-tier funding framework. This application exercise covers Tier 2 and Tier 3 funding. Tier 2 involves the funding of applied R&D projects that are industry-oriented and have potential for commercialisation, while Tier 3 involves the funding of exploratory and forward-looking projects. Application forms and the Application Guide are available at www.itf.gov.hk.
The application period commenced today (January 28) and will last until March 31 this year.
Further information on the ITSP funding schemes and application procedures is available on the ITF website and can be obtained from the ITF Secretariat at 21/F, West Wing, Central Government Offices, 2 Tim Mei Avenue, Tamar, Hong Kong (Tel: 3655 5725; fax: 2957 8726; email: enquiry@itf.gov.hk).
Ends/Tuesday, January 28, 2014
Issued at HKT 12:00
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