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The following is issued on behalf of the Hong Kong Monetary Authority:
Result of the tenders of RMB Sovereign Bonds held on June 28, 2012:
Tender Date : June 28, 2012
Bonds available for Tender : Three-year RMB Bonds
Issue Number : BCMKFB12024
Issue Date : June 29, 2012
Maturity Date : June 29, 2015
(or the closest
Coupon payment date)
Application Amount : RMB 31,258.5 million
Issue Amount : RMB 7,000 million
Average accepted Coupon Rate : 1.38%
Highest accepted Coupon Rate
(Bonds' Coupon) : 1.85%
Lowest accepted Coupon Rate : 0.00%
Allocation Ratio : Approximately 15.16%
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Tender Date : June 28, 2012
Bonds available for Tender : Five-year RMB Bonds
Issue Number : BCMKFB12025
Issue Date : June 29, 2012
Maturity Date : June 29, 2017
(or the closest
Coupon payment date)
Application Amount : RMB 16,912 million
Issue Amount : RMB 5,500 million
Average accepted Coupon Rate : 2.17%
Highest accepted Coupon Rate
(Bonds' Coupon) : 2.56%
Lowest accepted Coupon Rate : 1.00%
Allocation Ratio : Approximately 11.00%
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Tender Date : June 28, 2012
Bonds available for Tender : Seven-year RMB Bonds
Issue Number : BCMKFB12026
Issue Date : June 29, 2012
Maturity Date : June 29, 2019
(or the closest
Coupon payment date)
Application Amount : RMB 4,815 million
Issue Amount : RMB 1,000 million
Average accepted Coupon Rate : 2.08%
Highest accepted Coupon Rate
(Bonds' Coupon) : 2.65%
Lowest accepted Coupon Rate : 1.35%
Allocation Ratio : Approximately 5.10%
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Tender Date : June 28, 2012
Bonds available for Tender : Ten-year RMB Bonds
Issue Number : BCMKFB12027
Issue Date : June 29, 2012
Maturity Date : June 29, 2022
(or the closest
Coupon payment date)
Application Amount : RMB 3,028.5 million
Issue Amount : RMB 1,000 million
Average accepted Coupon Rate : 2.88%
Highest accepted Coupon Rate
(Bonds' Coupon) : 3.10%
Lowest accepted Coupon Rate : 0.00%
Allocation Ratio : Approximately 5.83%
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Tender Date : June 28, 2012
Bonds available for Tender : Fifteen-year
RMB Bonds
Issue Number : BCMKFB12028
Issue Date : June 29, 2012
Maturity Date : June 29, 2027
(or the closest
Coupon payment date)
Application Amount : RMB 2,666.5 million
Issue Amount : RMB 1,000 million
Average accepted Coupon Rate : 3.10%
Highest accepted Coupon Rate
(Bonds' Coupon) : 3.48%
Lowest accepted Coupon Rate : 1.99%
Allocation Ratio : Approximately 0.50%
Ends/Thursday, June 28, 2012
Issued at HKT 19:05
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