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The governments of the Hong Kong Special Administrative Region (HKSAR) and Guangdong Province today (May 19) invited applications for funding support for research and development (R&D) projects under the 2009 Guangdong-Hong Kong Technology Co-operation Funding Scheme (TCFS).
The funding scheme, first launched in 2004 by the Hong Kong/Guangdong Expert Group on Co-operation in Innovation and Technology, serves to enhance collaboration among universities, research institutes and technology enterprises in the two places, and upgrade the technology level of industry in the Greater Pearl River Delta region. The Shenzhen municipal government joined the scheme in 2005.
Since 2007, a category of projects jointly funded by the Guangdong and Hong Kong authorities or the Shenzhen and Hong Kong authorities has been introduced to the scheme to further enhance technology co-operation between the two sides.
A spokesman for the Innovation and Technology Commission (ITC) said, "The response to the scheme has been favourable. The two sides have supported over 850 R&D projects since the scheme was established in 2004, with a total funding of $1.91 billion."
As with last year, there are three categories of projects in the scheme. The first category are projects to be funded by the Innovation and Technology Fund (ITF) of Hong Kong. The second category are projects to be funded by the Mainland authorities. The third category are projects to be funded jointly by the Guangdong and Hong Kong authorities or the Shenzhen and Hong Kong authorities.
"There are 19 technology areas under the first category for which Hong Kong companies can submit funding applications. The governments of the two sides will also jointly provide funding support for projects under 12 technology areas under the third category. The technology areas supported under the scheme are relevant to the needs of industry and will enhance economic development in the Greater Pearl River Delta region," the spokesman said.
The ITC is also inviting proposals of more forward-looking and innovative applied R&D projects under Tier 3 of the Innovation and Technology Support Programme (ITSP) of the ITF.
The deadline for applications for both the TCFS and the Tier 3 of the ITSP is July 3. Application details (including the technology areas of project application under the TCFS) can be found on the ITF website (www.itf.gov.hk). Further information can be obtained from the ITF secretariat at 20/F, Wu Chung House, 213 Queen's Road East, Wan Chai, Hong Kong (tel. for TCFS: 2736 0055; tel. for Tier 3 of ITSP: 2737 2229; fax: 2957 8726; email: enquiry@itf.gov.hk).
Ends/Tuesday, May 19, 2009
Issued at HKT 18:14
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