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Proposals for innovative applied research and development projects are being invited under Tier 3 of the Innovation and Technology Support Programme (ITSP) of the Innovation and Technology Fund (ITF) until April 30.
"The Government has adopted a three-tier structure in funding proposals under the ITSP since 2005," a spokesman for the Innovation and Technology Commission said today (February 1).
Tier 1 covers proposals for the establishment of research and development (R&D) centres to undertake projects in their respective technology areas.
Tier 2 covers proposals with focused themes, including proposals submitted under the Guangdong-Hong Kong Technology Co-operation Funding Scheme (TCFS).
Tier 3 refers to proposals for more forward-looking and innovative applied R&D projects.
"Potential applicants are reminded that Tier 3 project proposals should be more exploratory in nature. The funding requested for each project proposal should not exceed $1 million and the project duration should not exceed 18 months. Exploratory, forward looking and innovative project proposals relevant to the technology areas of the R&D centres may also be submitted under the Tier 3 invitation," the spokesman said.
"Project proposals for follow-on R&D work of projects approved in previous rounds of Tier 3 invitations may be submitted under this round of invitation. Follow-up projects to, or which leverage on the results of, completed basic research projects undertaken either by the applicant organisation or other local or overseas research institutes may also be submitted.
"As the project proposals are expected to be more innovation and technology driven, industrial sponsorship is not mandatory. Nevertheless, industrial sponsorship is still encouraged and funding priority will be given to applications that have secured cash sponsorship.
"Applications will be assessed by a panel and only projects with exceptional merit such as those with a major technology breakthrough will be funded," the spokesman said.
He encouraged local universities, industry support organisations, trade and industry associations, professional bodies, research institutes and local companies to make use of the Tier 3 funding scheme to carry out innovative applied R&D activities. The deadline for submitting applications is April 30.
All application proposals must be submitted electronically through the Innovation and Technology Commission Funding Administrative System (www3.itf.gov.hk/). Under this arrangement, applicant organisations and project co-ordinators are required to register for access to the relevant application form.
All the relevant documents and information relating to the current invitation for Tier 3 applications including the ITSP guidebook are available from the ITF website (www.itf.gov.hk).
Further information can also be obtained from the ITF secretariat on 20/F, Wu Chung House, 213 Queen's Road East, Wan Chai, Hong Kong, or by calling 2737 2229.
Ends/Friday, February 1, 2008
Issued at HKT 16:15
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